Aug 11, 2020
Introducing the smallest packaged IC in its class, VORAGO expands VA416XX and VA108X0 offerings to meet any size project. Highly integrated, innovative and space-saving technology with pin-to-pin compatibility that eliminates a costly redesign process. Technology that answers the question: "What if radiation wasn't an issue?"
AUSTIN, Texas - Aug. 11, 2020 - PRLog -- VORAGO Technologies (https://voragotech.com) today announced the expansion of the highly integrated Radiation-Hardened Arm® Cortex® Microcontroller (MCU) family into Ball Grid Array packages. This announcement promises an increase of functionality options spanning size and scope while incorporating the company's patented HARDSIL® technology.
"As the space market transitions into smaller electrical designs, the need for a reduction in Size Weight and Power, or SWaP, of the components building those systems need to follow suit. The introduction of the VORAGO family of BGA processors allows the functionality of up to 8 ICs to be compressed down into one tiny 12x12mm BGA package." – Jason Wells, Director of Product Management, VORAGO Technologies
The expansion of packages for VA416XX and VA108X0 offers unprecedented choice in a marketplace dominated by limited, less-flexible legacy components. These new additions to the broader family of Arm® Microcontroller products from VORAGO drastically reduce the design footprint while offering more flexibility with applications in hi-rel, aerospace, military and defense.
VA416XX and VA108X0 family of products include the following features and benefits:
Contact
Jason Wells
***@voragotech.com
YOUR NEWS, OUR NETWORK.
Do you have Great News you want to tell the world?
Be it updates about your business or your community, you can make sure that it’s heard by submitting your story to our network reaching hundreds of news sites across 6 verticals.